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Winbond Electronics W66CM2NQUAHJ DRAM

DRAM Memory IC 4Gbit LVSTL_11 2.133 GHz 1.06V ~ 1.17V, 1.7V ~ 1.95V 200-WFBGA (10x14.5)

In Stock ActiveWinbond Electronics200-WFBGA (10x14.5)RoHS
W66CM2NQUAHJ 200-WFBGA (10x14.5) package illustration

Same model may have multiple batches, images only for reference.

W66CM2NQUAHJ
Part Number (MPN)
W66CM2NQUAHJ
Detailed Description
IC DRAM 4GBIT LVSTL 11 200WFBGA
Package
200-WFBGA (10x14.5)
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF W66CM2NQUAHJ Datasheet
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Technical Specifications

Winbond Electronics W66CM2NQUAHJ DRAM technical specifications.

General

Memory Size
4Gbit
RoHS
ROHS3 Compliant
Package / Case
200-WFBGA
Packaging
Tray
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TC)
Supply Voltage
1.06V ~ 1.17V, 1.7V ~ 1.95V
Lifecycle Status
Active
Max Frequency
2.133 GHz
Memory Type
Volatile

Related Parts Comparison (W66CM2NQUAHJ vs W66AP6NBUAFJ vs W66BQ2NQUAGJ vs W66AQ6NBUAHJ)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Package / Case200-WFBGA200-WFBGA200-WFBGA200-WFBGA
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 105°C (TC)-40°C ~ 105°C (TC)-40°C ~ 105°C (TC)-40°C ~ 105°C (TC)
Supply Voltage1.06V ~ 1.17V, 1.7V ~ 1.95V1.06V ~ 1.17V, 1.7V ~ 1.95V1.06V ~ 1.17V, 1.7V ~ 1.95V1.06V ~ 1.17V, 1.7V ~ 1.95V
Memory Size4Gbit1Gbit2Gbit1Gbit
Lifecycle StatusActiveActiveActiveActive
Access Time3.5 ns3.6 ns3.6 ns3.6 ns
Max Frequency2.133 GHz1.6 GHz1.867 GHz2.133 GHz
Memory FormatDRAMDRAMDRAMDRAM
Memory InterfaceLVSTL_11LVSTL_11LVSTL_06LVSTL_06
Memory Organization128M x 3264M x 1664M x 3264M x 16
Memory TypeVolatileVolatileVolatileVolatile
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