Winbond Electronics W66CL2NQUAFJ DRAM
IC DRAM 4GBIT LVSTL 11 200WFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W66CL2NQUAFJ
Detailed Description
IC DRAM 4GBIT LVSTL 11 200WFBGA
Package
200-WFBGA (10x14.5)
Lifecycle Status
NRND
RoHS State
RoHS Compliant
Datasheet
W66CL2NQUAFJ Datasheet
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Technical Specifications
Winbond Electronics W66CL2NQUAFJ DRAM technical specifications.
General
Interface
LVSTL_11
Memory Size
4Gbit
Data Bus Width
32
Maximum Clock Frequency
3200
RoHS
ROHS3 Compliant
Number of Pins
200
Package / Case
200-WFBGA
Packaging
Tray
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TC)
Alternate Parts Comparison (W66CL2NQUAFJ vs W66AP6NBUAFJ vs W66BQ2NQUAGJ vs W66AQ6NBUAHJ)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Manufacturer | -- | -- | -- | -- |
| Package / Case | 200-WFBGA | 200-WFBGA | 200-WFBGA | 200-WFBGA |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 105°C (TC) | -40°C ~ 105°C (TC) | -40°C ~ 105°C (TC) | -40°C ~ 105°C (TC) |
| Supply Voltage | 1.06V ~ 1.17V, 1.7V ~ 1.95V | 1.06V ~ 1.17V, 1.7V ~ 1.95V | 1.06V ~ 1.17V, 1.7V ~ 1.95V | 1.06V ~ 1.17V, 1.7V ~ 1.95V |
| Memory Size | 4Gbit | 1Gbit | 2Gbit | 1Gbit |
| Lifecycle Status | Not For New Designs | Active | Active | Active |
| Access Time | 3.5 ns | 3.6 ns | 3.6 ns | 3.6 ns |
| Max Frequency | 1.6 GHz | 1.6 GHz | 1.867 GHz | 2.133 GHz |
| Memory Format | DRAM | DRAM | DRAM | DRAM |
| Memory Interface | LVSTL_11 | LVSTL_11 | LVSTL_06 | LVSTL_06 |
| Memory Organization | 128M x 32 | 64M x 16 | 64M x 32 | 64M x 16 |
| Action |
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