Winbond Electronics W66CL2NQUAFJ DRAM

Name: W66CL2NQUAFJ
Brand: Winbond Electronics
SKU: W66CL2NQUAFJ

DRAM Memory IC 4Gbit LVSTL_11 1.6 GHz 1.06V ~ 1.17V, 1.7V ~ 1.95V 200-WFBGA (10x14.5)

In Stock ActiveWinbond Electronics200-WFBGA (10x14.5)RoHS

Same model may have multiple batches, images only for reference.

W66CL2NQUAFJ

Manufacturer

Winbond Electronics

Part Number (MPN)

W66CL2NQUAFJ

Technical Specifications

Winbond Electronics W66CL2NQUAFJ DRAM technical specifications.

General

Interface

LVSTL_11

Memory Size

4Gbit

Data Bus Width

Maximum Clock Frequency

3200

RoHS

ROHS3 Compliant

Number of Pins

200

Package / Case

200-WFBGA

Packaging

Tray

Mounting Type

Surface Mount

Operating Temperature

-40°C ~ 105°C (TC)

Related Parts Comparison (W66CL2NQUAFJ vs W66AP6NBUAFJ vs W66BQ2NQUAGJ vs W66AQ6NBUAHJ)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

	This Part	Related Part	Related Part	Related Part
	Winbond ElectronicsW66CL2NQUAFJ	Winbond ElectronicsW66AP6NBUAFJ	Winbond ElectronicsW66BQ2NQUAGJ	Winbond ElectronicsW66AQ6NBUAHJ
Package / Case	200-WFBGA	200-WFBGA	200-WFBGA	200-WFBGA
Mounting Type	Surface Mount	Surface Mount	Surface Mount	Surface Mount
Operating Temperature	-40°C ~ 105°C (TC)	-40°C ~ 105°C (TC)	-40°C ~ 105°C (TC)	-40°C ~ 105°C (TC)
Supply Voltage	1.06V ~ 1.17V, 1.7V ~ 1.95V	1.06V ~ 1.17V, 1.7V ~ 1.95V	1.06V ~ 1.17V, 1.7V ~ 1.95V	1.06V ~ 1.17V, 1.7V ~ 1.95V
Memory Size	4Gbit	1Gbit	2Gbit	1Gbit
Maximum Clock Frequency	3200	2.133 GHz	2.133 GHz	2.133 GHz
Lifecycle Status	Active	Active	Active	Active
Access Time	3.5 ns	3.6 ns	3.6 ns	3.6 ns
Max Frequency	1.6 GHz	1.6 GHz	1.867 GHz	2.133 GHz
Memory Format	DRAM	DRAM	DRAM	DRAM
Memory Interface	LVSTL_11	LVSTL_11	LVSTL_06	LVSTL_06
Memory Organization	128M x 32	64M x 16	64M x 32	64M x 16
Action	RFQ	RFQ	RFQ	RFQ

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