Winbond Electronics W66BQ6NBUAHJ DRAM
IC DRAM 2GBIT LVSTL 11 200WFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W66BQ6NBUAHJ
Detailed Description
IC DRAM 2GBIT LVSTL 11 200WFBGA
Package
200-WFBGA (10x14.5)
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
W66BQ6NBUAHJ Datasheet
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Technical Specifications
Winbond Electronics W66BQ6NBUAHJ DRAM technical specifications.
General
Memory Size
2Gbit
Data Bus Width
16 bit
Maximum Clock Frequency
2.133 GHz
RoHS
ROHS3 Compliant
Package / Case
200-WFBGA
Packaging
Tray
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TC)
Supply Voltage
1.06V ~ 1.17V, 1.7V ~ 1.95V
Lifecycle Status
Active
Alternate Parts Comparison (W66BQ6NBUAHJ vs W66BL6NBUAHJ vs W66BL6NBUAGJ vs W66BL6NBUAFJ)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Manufacturer | -- | -- | -- | -- |
| Package / Case | 200-WFBGA | 200-WFBGA | 200-WFBGA | 200-WFBGA |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 105°C (TC) | -40°C ~ 105°C (TC) | -40°C ~ 105°C (TC) | -40°C ~ 105°C (TC) |
| Supply Voltage | 1.06V ~ 1.17V, 1.7V ~ 1.95V | 1.06V ~ 1.17V, 1.7V ~ 1.95V | 1.06V ~ 1.17V, 1.7V ~ 1.95V | 1.06V ~ 1.17V, 1.7V ~ 1.95V |
| Memory Size | 2Gbit | 2Gbit | 2Gbit | 2Gbit |
| RoHS | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
| Lifecycle Status | Active | Not For New Designs | Not For New Designs | Not For New Designs |
| Access Time | 3.5 ns | 3.5 ns | 3.5 ns | 3.5 ns |
| Base Product Number | -- | -- | -- | -- |
| Max Frequency | 2.133 GHz | 2.133 GHz | 1.866 GHz | 1.6 GHz |
| Memory Format | DRAM | DRAM | DRAM | DRAM |
| Action |
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