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Winbond Electronics W66BQ2NQUAFJ DRAM

DRAM Memory IC 2Gbit LVSTL_06 1.6 GHz 1.06V ~ 1.17V, 1.7V ~ 1.95V 200-WFBGA (10x14.5)

In Stock ActiveWinbond Electronics200-WFBGA (10x14.5)
W66BQ2NQUAFJ 200-WFBGA (10x14.5) package illustration

Same model may have multiple batches, images only for reference.

W66BQ2NQUAFJ
Part Number (MPN)
W66BQ2NQUAFJ
Detailed Description
2GB LPDDR4X, DDP, X32, 1600MHZ,
Package
200-WFBGA (10x14.5)
Lifecycle Status
Active
Datasheet
PDF W66BQ2NQUAFJ Datasheet
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Technical Specifications

Winbond Electronics W66BQ2NQUAFJ DRAM technical specifications.

General

Memory Size
2Gbit
Maximum Clock Frequency
2.133 GHz
Package / Case
200-WFBGA
Packaging
Tray
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TC)
Supply Voltage
1.06V ~ 1.17V, 1.7V ~ 1.95V
Lifecycle Status
Active
Max Frequency
1.6 GHz
Memory Interface
LVSTL_06

Related Parts Comparison (W66BQ2NQUAFJ vs W66BL6NBUAHJ vs W66BL6NBUAGJ vs W66BL6NBUAFJ)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Package / Case200-WFBGA200-WFBGA200-WFBGA200-WFBGA
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 105°C (TC)-40°C ~ 105°C (TC)-40°C ~ 105°C (TC)-40°C ~ 105°C (TC)
Supply Voltage1.06V ~ 1.17V, 1.7V ~ 1.95V1.06V ~ 1.17V, 1.7V ~ 1.95V1.06V ~ 1.17V, 1.7V ~ 1.95V1.06V ~ 1.17V, 1.7V ~ 1.95V
Memory Size2Gbit2Gbit2Gbit2Gbit
Lifecycle StatusActiveActiveActiveActive
Access Time3.6 ns3.5 ns3.5 ns3.5 ns
Max Frequency1.6 GHz2.133 GHz1.866 GHz1.6 GHz
Memory FormatDRAMDRAMDRAMDRAM
Memory InterfaceLVSTL_06LVSTL_11LVSTL_11LVSTL_11
Memory Organization64M x 32128M x 16128M x 16128M x 16
Memory TypeVolatileVolatileVolatileVolatile
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