Samsung Semiconductor K4S561632E-UI75 DRAM
DRAM Chip DDR2 SDRAM 1G-Bit 1.8V 60-Pin FBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
K4S561632E-UI75
Detailed Description
DRAM Chip DDR2 SDRAM 1G-Bit 1.8V 60-Pin FBGA
Package
FBGA
Key Features
Package / Case: FBGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
K4S561632E-UI75 Datasheet
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Technical Specifications
Samsung Semiconductor K4S561632E-UI75 DRAM technical specifications.
General
RoHS
Compliant
Package / Case
FBGA
Access Time
7.5ns
Frequency
133MHz
Lead Free
Lead Free
Alternate Parts Comparison (K4S561632E-UI75 vs K4J10324KE-HC12 vs K4A4G085WE-BCRC vs K4AAG165WA-BCWE)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| RoHS | Compliant | -- | Compliant | Compliant |
| Package / Case | FBGA | FBGA | -- | -- |
| Frequency | 133MHz | -- | -- | -- |
| Access Time | 7.5ns | -- | -- | -- |
| Lead Free | Lead Free | -- | -- | -- |
| Mounting Type | -- | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -- | 0 ~ 85 | 0 ~ 95 | 0 ~ 85 |
| Number of Pins | -- | 136 | 78 | 96 |
| Automotive | -- | No | No | No |
| Number of Internal Banks | -- | 8 | 16 | 16 |
| Number of Words Per Bank | -- | 4M | 32M | 64M |
| Organization | -- | 32Mx32 | 512Mx8 | 1Gx16 |
| Action |
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