Samsung Semiconductor K4J10324KE-HC12 DRAM
GDDR3 SDRAM 1Gbit 32Mx32 1.8V 136-Pin FBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
K4J10324KE-HC12
Detailed Description
GDDR3 SDRAM 1Gbit 32Mx32 1.8V 136-Pin FBGA
Package
FBGA
Key Features
Package / Case: FBGA; Mounting Type: Surface Mount
Lifecycle Status
Active
Datasheet
K4J10324KE-HC12 Datasheet
Quick Jump:
Technical Specifications
Samsung Semiconductor K4J10324KE-HC12 DRAM technical specifications.
General
Data Bus Width
32
Number of Pins
136
Package / Case
FBGA
Mounting Type
Surface Mount
Operating Temperature
0 ~ 85
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pcb
136
Alternate Parts Comparison (K4J10324KE-HC12 vs K4T1G164QF-BCE6 vs K4T1G084QF-BCE6 vs K4M56323PI-HG75)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | FBGA | FBGA | FBGA | FBGA |
| Density | 1G | 1Gb | 1Gb | 256Mb |
| Operating Temperature | 0 ~ 85 | 0°C ~ 95°C | 0°C ~ 95°C | -- |
| Mounting Type | Surface Mount | -- | -- | Surface Mount |
| Address Bus Width | 15 | -- | 17b | -- |
| Organization | 32Mx32 | -- | -- | 8MX32 |
| Data Bus Width | 32 | -- | -- | -- |
| Number of Pins | 136 | -- | -- | -- |
| AEC Qualified | No | -- | -- | -- |
| Automotive | No | -- | -- | -- |
| Basic Package Type | Ball Grid Array | -- | -- | -- |
| Cage Code | 1542F | -- | -- | -- |
| Action |
More Parts in DRAM
Browse additional parts from the same category, grouped by series, package type, and manufacturer. These are catalog suggestions — not verified pin-compatible alternates.
K4T51163QQ-BCE7Samsung SemiconductorDRAM Chip DDR2 SDRAM 512Mbit 32Mx16 1.8V [FBGA | Obsolete/discontinued; stocked for maintenance and LTB | RoHS Compli…