Samsung Semiconductor K4B2G0846D-HYK0 DRAM
DRAM Memory IC 2Gb 1.6GHz FBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
K4B2G0846D-HYK0
Detailed Description
DDR DRAM, 256MX8, 0.225ns, CMOS, PBGA78
Package
FBGA
Key Features
Package / Case: FBGA; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
K4B2G0846D-HYK0 Datasheet
Quick Jump:
Technical Specifications
Samsung Semiconductor K4B2G0846D-HYK0 DRAM technical specifications.
General
RoHS
Yes
Number of Pins
78
Package / Case
FBGA
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 95°C
Lifecycle Status
Obsolete
Access Time
225ps
Address Bus Width
18b
Density
2Gb
Max Frequency
1.6GHz
Alternate Parts Comparison (K4B2G0846D-HYK0 vs K4M51163PE-BG75 vs K4A4G085WE-BCRC vs K4AAG165WA-BCWE)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| RoHS | Yes | Compliant | Compliant | Compliant |
| Mounting Type | Surface Mount | -- | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 95°C | -- | 0 ~ 95 | 0 ~ 85 |
| Number of Pins | 78 | -- | 78 | 96 |
| Lifecycle Status | Obsolete | -- | Last Time Buy | LTB |
| Automotive | No | -- | No | No |
| Data Bus Width Bit | 8 | -- | 8 | 16 |
| Dram Type | DDR3L SDRAM | -- | DDR4 SDRAM | DDR4 SDRAM |
| Maximum Clock Rate Mhz | 1600 | -- | 2400 | 3200 |
| Number of Bits Word Bit | 8 | -- | 8 | 16 |
| Number of Internal Banks | 8 | -- | 16 | 16 |
| Number of IO Lines Bit | 8 | -- | 8 | 16 |
| Action |
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