Samsung Semiconductor K4M56323PI-HG75 DRAM
MOBILE-SDRAM 2M X 16BIT X 4 BANKS MOBILE SDRAM IN 54FBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
K4M56323PI-HG75
Detailed Description
Package
FBGA
Key Features
Package / Case: FBGA; Mounting Type: Surface Mount; Supply Voltage: 1.8V
Lifecycle Status
Unknown
RoHS State
Compliant
Datasheet
K4M56323PI-HG75 Datasheet
Quick Jump:
Technical Specifications
Samsung Semiconductor K4M56323PI-HG75 DRAM technical specifications.
General
Package / Case
FBGA
Density
256Mb
Mounting Type
Surface Mount
Supply Voltage
1.8V
Organization
8MX32
RoHS
Compliant
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
K4H560838H-UCCCSamsung SemiconductorPackage / Case: FBGA | Supply Voltage: 2.6V | Access Time Max: 0.55ns | Address Bus Width: 15b | Data Bus Width: 8b | Density: 256Mb
K4T1G084QF-BCE6Samsung SemiconductorPackage / Case: FBGA | Supply Voltage: 1.8V | Access Time: 0.45ns | Address Bus Width: 17b | Density: 1Gb | Max Frequency: 667MHz
K4AAG165WA-BCTDSamsung SemiconductorPackage: BGA | Mounting Type: Surface Mount | Memory Size: 16G | Interface: POD | Number of Pins: 96 | Organization: 1Gx16
K4T1G164QF-BCE6Samsung SemiconductorPackage / Case: FBGA | Supply Voltage: 1.8V | Access Time: 0.45ns | Access Time Max: 0.45ns | Density: 1Gb | Max Frequency: 667MHz