Samsung Semiconductor K4AAG165WA-BCTD DRAM
DRAM Chip DDR4 SDRAM 16Gbit 1Gx16 1.2V 96-Pin FBGA

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
K4AAG165WA-BCTD
Detailed Description
Package
FBGA
Key Features
Package: BGA; Mounting Type: Surface Mount; Memory Size: 16G; Interface: POD
Lifecycle Status
LTB
RoHS State
Compliant
Datasheet
K4AAG165WA-BCTD Datasheet
Quick Jump:
Technical Specifications
Samsung Semiconductor K4AAG165WA-BCTD DRAM technical specifications.
General
Organization
1Gx16
HTS
8542.32.00.36
ECCN
EAR99
Ppap
No
Data Bus Width Bit
16
Number of Internal Banks
16
Automotive
No
Min Operating Temp
0
Max Operating Temp
85
Supplier Package
FBGA
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
K4H560838H-UCCCSamsung SemiconductorPackage / Case: FBGA | Supply Voltage: 2.6V | Access Time Max: 0.55ns | Address Bus Width: 15b | Data Bus Width: 8b | Density: 256Mb
K4T1G084QF-BCE6Samsung SemiconductorPackage / Case: FBGA | Supply Voltage: 1.8V | Access Time: 0.45ns | Address Bus Width: 17b | Density: 1Gb | Max Frequency: 667MHz
K4T1G164QF-BCE6Samsung SemiconductorPackage / Case: FBGA | Supply Voltage: 1.8V | Access Time: 0.45ns | Access Time Max: 0.45ns | Density: 1Gb | Max Frequency: 667MHz
K4T1G164QQ-HCE6000Samsung SemiconductorPackage / Case: FBGA | Mounting Type: Surface Mount | Supply Voltage: 1.8V | Organization: 64MX16