Samsung Semiconductor K4J10324KE-HC12 DRAM
GDDR3 SDRAM 1Gbit 32Mx32 1.8V 136-Pin FBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
K4J10324KE-HC12
Detailed Description
Package
FBGA
Key Features
Package / Case: FBGA; Mounting Type: Surface Mount
Lifecycle Status
Unknown
RoHS State
Unknown
Datasheet
K4J10324KE-HC12 Datasheet
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Technical Specifications
Samsung Semiconductor K4J10324KE-HC12 DRAM technical specifications.
General
Basic Package Type
Ball Grid Array
Inventory Source
Winsource
Inventory Source File
/Volumes/T7 Shield/电子元器件数据/抓取的数据/Win-Source数据/winsource_未曾下架数据_202605_1.xlsx
Inventory As of
2026-05-15
Source Manufacturer
Samsung
Source Category
Integrated Circuits (ICs) > Memory > Unclassified Memory
Stock
6000
Extracted Price
1.3052
Price Formula
winsource min price * 2
Package Family Name
BGA
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