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DRAM

DRAM (Dynamic Random-Access Memory) provides high-density, high-bandwidth volatile storage for computing systems, display buffers, and network packet processing. This category covers SDR, DDR, DDR2, DDR3, DDR4, DDR5, LPDDR, and Mobile SDRAM ICs from Micron, Samsung, Alliance Memory, ISSI, and Intelligent Memory.

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Browse DRAM Products

Showing 1–10 of 6,150 products
PART NUMBERMANUFACTURERDESCRIPTIONSTOCKQTY / ACTION
W9751G6NB-25IWinbond Electronics17,142
MT44K64M18RB-093E:ATRMicron Technology Inc.490
PF38F5070M0Y0BEBMicron Technology Inc.In Stock
EDJ4216EFBG-GNL-F-DMicron Technology Inc.In Stock
MT48H16M16LFBF-6ITMicron Technology Inc.30,082
MT42L128M32D1GU-18WTMicron Technology Inc.In Stock
EDFP264A2PB-JD-F-RMicron Technology Inc.2,307
W949D2KBJX5EWinbond Electronics1,416

About DRAM

DRAM (Dynamic Random-Access Memory) ICs are volatile semiconductor memories designed to provide ultra-high-speed, high-density working storage for active software, firmware, and operating system data in microprocessors and digital signal processors. Utilizing a single-transistor, single-capacitor cell architecture, DRAM delivers massive storage capacities at far lower costs per bit than SRAM, though it requires continuous electrical refreshing to maintain data integrity.

This category encompasses DDR3, DDR4, and low-power LPDDR memory chips, as well as legacy SDRAM ICs. Key selection parameters include memory density (ranging from megabits to gigabits), data rate (MT/s or MHz), bus width (typically x8, x16, or x32 configurations), operating voltage (e.g., 1.2V for DDR4, 1.35V/1.5V for DDR3), package type (BGA, TSOP), and temperature grades. High-reliability designs require industrial or automotive temperature tolerances.

Browse Octatronics to search and compare DRAM chips from market leaders including Micron Technology, Samsung Semiconductor, Winbond, ISSI, and Alliance Memory. Verify lifecycle statuses, datasheets, and submit bulk RFQs online to secure allocations.

Frequently Asked Questions

Octatronics can help source a wide range of DRAM from major manufacturers worldwide, including active production parts, long-lead-time items, and hard-to-find components.

Yes. You can submit a single part number or upload a BOM with multiple parts. Our team will check stock, date code, lead time, and pricing for each item.

Availability depends on the specific part number and supplier source. For important orders, buyers can request packaging photos, labels, date code information, and traceability documents.

Yes. Octatronics supports sourcing for active, end-of-life, obsolete, and hard-to-find components through our global supplier network.

Please provide the part number, manufacturer, quantity, required date code, target price, delivery country, and whether original packaging or COC is required.

Articles & Technology

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DDR4 vs DDR5: Key Differences in Speed, Latency, Power, Capacity, and Compatibility

DDR4 vs DDR5: Key Differences in Speed, Latency, Power, Capacity, and Compatibility

DDR5 is the newer memory standard, offering higher bandwidth, lower nominal operating voltage, improved module architecture, and better capacity scaling than DDR4. However, DDR4 remains widely used in existing PCs, embedded systems, industrial equipment, and cost-sensitive platforms. The best choice depends on your motherboard, processor, workload, budget, and long-term sourcing requirements.

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Circuit Board Component Identification: How to Identify PCB Components by Markings, Shape, and Codes

Circuit Board Component Identification: How to Identify PCB Components by Markings, Shape, and Codes

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IC Top Marking Codes Explained: How to Identify SMD Chips from Package Markings

IC Top Marking Codes Explained: How to Identify SMD Chips from Package Markings

IC top marking codes are abbreviated package markings used to identify semiconductor devices, especially small SMD chips that cannot fit a full part number. Buyers should use the marking as a starting point, then verify manufacturer logo, package, pin count, date code, lot code, datasheet, packing label, and supplier documentation. Official manufacturer marking tools and datasheets should be used before relying on third-party SMD code databases.

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DDR6 RAM: What We Know So Far About Next-Generation Memory

DDR6 RAM: What We Know So Far About Next-Generation Memory

DDR6 RAM is the next planned generation of DDR memory technology after DDR5, designed to support higher bandwidth, improved efficiency, and future computing platforms with greater data movement requirements. Although DDR6 is not yet a mainstream commercial product, major memory manufacturers and platform developers are already preparing for the next stage of DRAM evolution.

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Finding a pin-compatible alternative for an obsolete IC is not just about matching the package. It requires a structured review of pinout, footprint, electrical parameters, functional behavior, lifecycle status, sourcing reliability, and sample validation.

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Pin-to-Pin Replacement Parts: How to Check Compatibility Before Sourcing

Pin-to-Pin Replacement Parts: How to Check Compatibility Before Sourcing

When an original electronic component becomes obsolete, unavailable, or too expensive, a pin-to-pin replacement part can help avoid PCB redesign and keep production or repair projects moving. However, pin-to-pin compatibility does not automatically mean the part is a safe drop-in replacement. This guide explains how to check package, footprint, pinout, electrical ratings, thermal performance, timing behavior, firmware requirements, compliance status, and lifecycle risk before sourcing replacement parts. It also provides a practical checklist to help engineers, buyers, and maintenance teams reduce sourcing mistakes and verify compatibility before purchase.

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How to Choose Electronic Components for Reliable Hardware Design

How to Choose Electronic Components for Reliable Hardware Design

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