Samsung Semiconductor K4M56323PI-HG75 DRAM
DRAM Memory IC 256Mb 1.8V FBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
K4M56323PI-HG75
Detailed Description
MOBILE-SDRAM 2M X 16BIT X 4 BANKS MOBILE SDRAM IN 54FBGA
Package
FBGA
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
K4M56323PI-HG75 Datasheet
Quick Jump:
Technical Specifications
Samsung Semiconductor K4M56323PI-HG75 DRAM technical specifications.
General
RoHS
Compliant
Number of Pins
54
Package / Case
FBGA
Mounting Type
Surface Mount
Supply Voltage
1.8V
Lifecycle Status
Obsolete
Density
256Mb
Organization
8MX32
Automotive
No
PPAP
No
Alternate Parts Comparison (K4M56323PI-HG75 vs K4M51163PE-BG75 vs K4AAG165WA-BCTD vs K4J10324KE-HC12)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | FBGA | FBGA | -- | FBGA |
| Mounting Type | Surface Mount | -- | Surface Mount | Surface Mount |
| Number of Pins | 54 | -- | 96 | 136 |
| RoHS | Compliant | Compliant | Compliant | -- |
| Automotive | No | -- | No | No |
| Organization | 8MX32 | -- | 1Gx16 | 32Mx32 |
| PPAP | No | -- | No | No |
| Action |
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