Samsung Semiconductor K4A4G165WE-BCPB DRAM
DRAM Chip DDR4 SDRAM 4Gbit 256Mx16 1.2V 96-Pin FBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
K4A4G165WE-BCPB
Detailed Description
Package
FBGA
Key Features
Package: BGA; Mounting Type: Surface Mount; Memory Size: 4G; Interface: POD
Lifecycle Status
LTB
RoHS State
Compliant
Datasheet
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Technical Specifications
Samsung Semiconductor K4A4G165WE-BCPB DRAM technical specifications.
General
Organization
256Mx16
HTS
COMPONENTS
ECCN
EAR99
Ppap
No
Data Bus Width Bit
16
Operating Current Ma
118
Number of Internal Banks
8
Automotive
No
Address Bus Width Bit
20
Min Operating Temp
0
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