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Samsung Semiconductor K4H561638J-LCB3T00 DRAM

DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66

In Stock ActiveSamsung SemiconductorTSOP-II
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K4H561638J-LCB3T00
Part Number (MPN)
K4H561638J-LCB3T00
Detailed Description
DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66
Package
TSOP-II
Lifecycle Status
Active
Datasheet
PDF K4H561638J-LCB3T00 Datasheet
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Technical Specifications

Samsung Semiconductor K4H561638J-LCB3T00 DRAM technical specifications.

General

RoHS
True
Number of Pins
66
Operating Temperature
0 ~ 70
Terminal Position
DUAL
Jedec Package Code
R-PDSO-G66
Width
10.16
Length
22.22
Number of Functions
1
Temperature Grade
COMMERCIAL
Supply Voltage Nom Vsup
2.5

Alternate Parts Comparison (K4H561638J-LCB3T00 vs K4B2G1646Q-BCMA vs K4B2G0846D-HCH9 vs K4M561633G-BN75)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Operating Temperature0 ~ 70--0 ~ 95-25 ~ 85
Number of Pins66--7854
Access Time Max0.7----5.4
Jedec Package CodeR-PDSO-G66----R-PBGA-B54
Length22.22----11
Memory IC TypeDDR DRAM----SYNCHRONOUS DRAM
Military SpecFalse----False
Number of Functions1----1
Number of Ports1----1
Number of Words16777216----16777216
Number of Words Code16000000----16000000
Supply Voltage Max Vsup2.7----3.6
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