Samsung Semiconductor K4S641632F-TC70T00 DRAM
64Mbit SDRAM 4Mx16 3.3V 54-Pin TSOP-II SMT Memory IC
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
K4S641632F-TC70T00
Detailed Description
64Mbit SDRAM 4Mx16 3.3V 54-Pin TSOP-II SMT Memory IC
Package
TSOP-II
Key Features
Package / Case: TSOP-II; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
No
Datasheet
K4S641632F-TC70T00 Datasheet
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Technical Specifications
Samsung Semiconductor K4S641632F-TC70T00 DRAM technical specifications.
General
Data Bus Width
16
RoHS
No
Number of Pins
54
Package / Case
TSOP-II
Mounting Type
Surface Mount
Operating Temperature
0 ~ 70
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package Description
Thin Small Outline Package (Type II)
Lead Shape
Gull-wing
Alternate Parts Comparison (K4S641632F-TC70T00 vs K4B2G1646Q-BCMA vs K4M561633G-BN75 vs K4B2G0846D-HCH9)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Operating Temperature | 0 ~ 70 | -- | -25 ~ 85 | 0 ~ 95 |
| Number of Pins | 54 | -- | 54 | 78 |
| RoHS | No | -- | Yes | Compliant |
| Mounting Type | Surface Mount | -- | -- | Surface Mount |
| Automotive | No | -- | -- | No |
| Lead Shape | Gull-wing | -- | -- | Ball |
| Number of Internal Banks | 4 | -- | -- | 8 |
| Number of Words Per Bank | 1M | -- | -- | 32M |
| Organization | 4Mx16 | -- | -- | 256Mx8 |
| Ppap | No | -- | -- | No |
| Package / Case | TSOP-II | -- | -- | -- |
| Data Bus Width | 16 | -- | -- | -- |
| Action |
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