Samsung Semiconductor K4S643232F-TC70 DRAM
2M X 32 SDRAM, FOUR BANKS OPERATION, 3.3V POWER SUPPLY
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
K4S643232F-TC70
Detailed Description
2M X 32 SDRAM, FOUR BANKS OPERATION, 3.3V POWER SUPPLY
Package
TSOP-II
Key Features
Package / Case: TSOP-II; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
No
Datasheet
K4S643232F-TC70 Datasheet
Quick Jump:
Technical Specifications
Samsung Semiconductor K4S643232F-TC70 DRAM technical specifications.
General
RoHS
No
Number of Pins
86
Package / Case
TSOP-II
Mounting Type
Surface Mount
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package Description
Thin Small Outline Package (Type II)
Lead Shape
Gull-wing
Pcb
86
Package Length Mm
22.62(Max)
Alternate Parts Comparison (K4S643232F-TC70 vs K4B2G1646Q-BCMA vs K4M561633G-BN75 vs K4B2G0846D-HCH9)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Number of Pins | 86 | -- | 54 | 78 |
| RoHS | No | -- | Yes | Compliant |
| Mounting Type | Surface Mount | -- | -- | Surface Mount |
| Automotive | No | -- | -- | No |
| Lead Shape | Gull-wing | -- | -- | Ball |
| Ppap | No | -- | -- | No |
| Package / Case | TSOP-II | -- | -- | -- |
| AEC Qualified | No | -- | -- | -- |
| Basic Package Type | Lead-Frame SMT | -- | -- | -- |
| Cage Code | 1542F | -- | -- | -- |
| Package Description | Thin Small Outline Package (Type II) | -- | -- | -- |
| Package Family Name | SOP | -- | -- | -- |
| Action |
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