Samsung Semiconductor K4M561633G-BN75 Memory ICs
["Integrated Circuits (ICs)", "Memory", "Unclassified Memory"]
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
K4M561633G-BN75
Detailed Description
["Integrated Circuits (ICs)", "Memory", "Unclassified Memory"]
Lifecycle Status
Active
Datasheet
K4M561633G-BN75 Datasheet
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Technical Specifications
Samsung Semiconductor K4M561633G-BN75 Memory ICs technical specifications.
General
RoHS
Yes
Number of Pins
54
Operating Temperature
-25 ~ 85
Terminal Position
BOTTOM
Jedec Package Code
R-PBGA-B54
Width
8
Length
11
Number of Functions
1
Temperature Grade
OTHER
Supply Voltage Nom Vsup
3
Alternate Parts Comparison (K4M561633G-BN75 vs K4B2G1646Q-BCMA vs K4B2G0846D-HCH9)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | |
|---|---|---|---|
| Operating Temperature | -25 ~ 85 | -- | 0 ~ 95 |
| Number of Pins | 54 | -- | 78 |
| RoHS | Yes | -- | Compliant |
| Access Time Max | 5.4 | -- | -- |
| Clock Frequency Max Fclk | 133 | -- | -- |
| IO Type | COMMON | -- | -- |
| Jedec Package Code | R-PBGA-B54 | -- | -- |
| Lead Free | Yes | -- | -- |
| Length | 11 | -- | -- |
| Memory IC Type | SYNCHRONOUS DRAM | -- | -- |
| Military Spec | False | -- | -- |
| Number of Functions | 1 | -- | -- |
| Action |
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