Samsung Semiconductor K4B2G0846D-HCH9 Memory ICs
["Integrated Circuits (ICs)", "Memory", "Unclassified Memory"]
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
K4B2G0846D-HCH9
Detailed Description
["Integrated Circuits (ICs)", "Memory", "Unclassified Memory"]
Package
BGA
Lifecycle Status
Obsolete
Datasheet
K4B2G0846D-HCH9 Datasheet
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Technical Specifications
Samsung Semiconductor K4B2G0846D-HCH9 Memory ICs technical specifications.
General
Interface
SSTL_1.5
Memory Size
2G
RoHS
Compliant
Number of Pins
78
Mounting Type
Surface Mount
Operating Temperature
0 ~ 95
Supply Voltage
1.425 ~ 1.575
Lifecycle Status
Obsolete
Automotive
No
PPAP
No
Alternate Parts Comparison (K4B2G0846D-HCH9 vs K4B2G1646Q-BCMA vs K4M561633G-BN75)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | |
|---|---|---|---|
| RoHS | Compliant | Yes | Yes |
| Package | BGA | FBGA | FBGA-54 |
| Operating Temperature | 0 ~ 95 | -- | -25 ~ 85 |
| Supply Voltage | 1.425 ~ 1.575 | -- | 3 |
| Interface | SSTL_1.5 | -- | SYNCHRONOUS DRAM |
| Number of Pins | 78 | -- | 54 |
| Memory Organization | 256Mx8 | -- | 16MX16 |
| Mounting Type | Surface Mount | -- | -- |
| Memory Size | 2G | -- | -- |
| Lifecycle Status | Obsolete | -- | -- |
| Address Bus Width Bit | 18 | -- | -- |
| Automotive | No | -- | -- |
| Action |
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