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NXP Semiconductors MM912J637AM2EPR2 Microcontroller, Microprocessor, FPGA Modules

IC MCU LIN BATT MONITOR 48QFN

26,400 ActiveNXP Semiconductors48-VFQFN Exposed PadRoHS
MM912J637AM2EPR2 48-VFQFN Exposed Pad package illustration

Same model may have multiple batches, images only for reference.

MM912J637AM2EPR2
Manufacturer
Part Number (MPN)
MM912J637AM2EPR2
Detailed Description
IC MCU LIN BATT MONITOR 48QFN
Package
48-VFQFN Exposed Pad
Key Features
Package / Case: 48-VFQFN Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF MM912J637AM2EPR2 Datasheet
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Technical Specifications

NXP Semiconductors MM912J637AM2EPR2 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Interface
LIN, SCI, SPI
RAM Size
6K x 8
RoHS
Yes
Package / Case
48-VFQFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C
Supply Voltage
2.25V ~ 5.5V
Lifecycle Status
Active
Number of I/O
8
Core Processor
S12

Related Parts Comparison (MM912J637AM2EPR2 vs LPC5502JHI48J vs MKW37A512VFT4R vs LPC5504JHI48J)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Package / Case48-VFQFN Exposed Pad48-VFQFN Exposed Pad48-VFQFN Exposed Pad48-VFQFN Exposed Pad
Mounting TypeSurface MountSurface Mount, Wettable FlankSurface Mount, Wettable FlankSurface Mount, Wettable Flank
Operating Temperature-40°C ~ 125°C-40°C ~ 105°C (TA)-40°C ~ 105°C (TA)-40°C ~ 105°C (TA)
Supply Voltage2.25V ~ 5.5V1.8V ~ 3.6V1.71V ~ 3.6V1.8V ~ 3.6V
Core ProcessorS12ARM® Cortex®-M33ARM® Cortex®-M0+ARM® Cortex®-M33
RAM Size6K x 848K x 864K x 880K x 8
RoHSYesYesYesYes
Lifecycle StatusActiveActiveActiveActive
PackageQFN-48SOT619-28HVQFN-48HVQFN-48
Program Memory TypeFLASH (128kB)FlashFlashFlash
Number of I/O830--30
Series--LPC550xKinetis KW3LPC550x
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