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NXP Semiconductors MC9S08AC8MFDE Microcontroller, Microprocessor, FPGA Modules

IC MCU 8BIT 8KB FLASH 48QFN

17,647 ActiveNXP Semiconductors48-VFQFN Exposed PadRoHS
MC9S08AC8MFDE 48-VFQFN Exposed Pad package illustration

Same model may have multiple batches, images only for reference.

MC9S08AC8MFDE
Manufacturer
Part Number (MPN)
MC9S08AC8MFDE
Detailed Description
IC MCU 8BIT 8KB FLASH 48QFN
Package
48-VFQFN Exposed Pad
Key Features
Package / Case: 48-VFQFN Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF MC9S08AC8MFDE Datasheet
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Technical Specifications

NXP Semiconductors MC9S08AC8MFDE Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
768 x 8
RoHS
Yes
Package / Case
48-VFQFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
2.7V ~ 5.5V
Lifecycle Status
Active
Peripherals
LVD, POR, PWM, WDT
Number of I/O
38
Speed
40MHz

Related Parts Comparison (MC9S08AC8MFDE vs MC9S08RE16CFDE vs MC9S08GT16CFDER vs MC9S08GT60CFDER)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Package / Case48-VFQFN Exposed Pad48-VFQFN Exposed Pad48-VFQFN Exposed Pad48-VFQFN Exposed Pad
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 125°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)
Supply Voltage2.7V ~ 5.5V1.8V ~ 3.6V1.8V ~ 3.6V1.8V ~ 3.6V
Core ProcessorS08S08S08S08
Core Size8-Bit8-Bit8-Bit8-Bit
RAM Size768 x 81K x 81K x 84K x 8
RoHSYesYesYesYes
Lifecycle StatusActiveObsoleteObsoleteObsolete
ConnectivityI²C, SCI, SPISCII²C, SCI, SPII²C, SCI, SPI
Number of I/O38393939
Oscillator TypeInternalInternalInternalInternal
Action

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