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NXP Semiconductors LPC2103FHN48H/6,51 Microcontroller, Microprocessor, FPGA Modules

IC MCU 16/32B 32KB FLASH 48HVQFN

14,189NXP Semiconductors48-VFQFN Exposed PadRoHS
LPC2103FHN48H/6,51 48-VFQFN Exposed Pad package illustration

Same model may have multiple batches, images only for reference.

LPC2103FHN48H/6,51
Manufacturer
Part Number (MPN)
LPC2103FHN48H/6,51
Detailed Description
IC MCU 16/32B 32KB FLASH 48HVQFN
Package
48-VFQFN Exposed Pad
Key Features
Package / Case: 48-VFQFN Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF LPC2103FHN48H/6,51 Datasheet
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Technical Specifications

NXP Semiconductors LPC2103FHN48H/6,51 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
8K x 8
RoHS
Yes
Package / Case
48-VFQFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
1.65V ~ 3.6V
Lifecycle Status
Obsolete
Peripherals
POR, PWM, WDT
Number of I/O
32
Speed
70MHz

Related Parts Comparison (LPC2103FHN48H/6,51 vs LPC5502JHI48J vs LPC5504JHI48J vs MM912J637AM2EPR2)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Package / Case48-VFQFN Exposed Pad48-VFQFN Exposed Pad48-VFQFN Exposed Pad48-VFQFN Exposed Pad
Mounting TypeSurface MountSurface Mount, Wettable FlankSurface Mount, Wettable FlankSurface Mount
Operating Temperature-40°C ~ 85°C (TA)-40°C ~ 105°C (TA)-40°C ~ 105°C (TA)-40°C ~ 125°C
Supply Voltage1.65V ~ 3.6V1.8V ~ 3.6V1.8V ~ 3.6V2.25V ~ 5.5V
Core ProcessorARM7®ARM® Cortex®-M33ARM® Cortex®-M33S12
RAM Size8K x 848K x 880K x 86K x 8
RoHSYesYesYesYes
Lifecycle StatusObsoleteActiveActiveActive
Number of I/O3230308
PackageVFQFN-48SOT619-28HVQFN-48QFN-48
Program Memory TypeFlashFlashFlashFLASH (128kB)
Core Size16/32-Bit32-Bit32-Bit--
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