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NXP Semiconductors LPC2103FHN48H/6,51 Microcontroller, Microprocessor, FPGA Modules

IC MCU 16/32B 32KB FLASH 48HVQFN

14,189NXP Semiconductors48-VFQFN Exposed PadRoHS
LPC2103FHN48H/6,51 - No Image Available

Same model may have multiple batches, images only for reference.

LPC2103FHN48H/6,51
Manufacturer
Part Number (MPN)
LPC2103FHN48H/6,51
Detailed Description
IC MCU 16/32B 32KB FLASH 48HVQFN
Package
48-VFQFN Exposed Pad
Key Features
Package / Case: 48-VFQFN Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF LPC2103FHN48H/6,51 Datasheet
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Technical Specifications

NXP Semiconductors LPC2103FHN48H/6,51 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
8K x 8
Package / Case
48-VFQFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
1.65V ~ 3.6V
Peripherals
POR, PWM, WDT
Number of I/O
32
Speed
70MHz
Core Processor
ARM7®
Program Memory Type
Flash

Alternate Parts Comparison (LPC2103FHN48H/6,51 vs LPC5502JHI48J vs LPC5504JHI48J vs MM912J637AM2EPR2)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case48-VFQFN Exposed Pad48-VFQFN Exposed Pad48-VFQFN Exposed Pad48-VFQFN Exposed Pad
Mounting TypeSurface MountSurface Mount, Wettable FlankSurface Mount, Wettable FlankSurface Mount
Operating Temperature-40°C ~ 85°C (TA)-40°C ~ 105°C (TA)-40°C ~ 105°C (TA)-40°C ~ 125°C
Supply Voltage1.65V ~ 3.6V1.8V ~ 3.6V1.8V ~ 3.6V2.25V ~ 5.5V
Core ProcessorARM7®ARM® Cortex®-M33ARM® Cortex®-M33S12
RAM Size8K x 848K x 880K x 86K x 8
Program Memory TypeFlashFlashFlashFLASH (128kB)
Core Size16/32-Bit32-Bit32-Bit--
ConnectivityI²C, Microwire, SPI, SSI, SSP, UART/USARTCANBus, Flexcomm, I²C, SPI, UART/USARTCANBus, Flexcomm, I²C, SPI, UART/USART--
Data ConvertersA/D 8x10bA/D 7x16b SARA/D 7x16b SAR--
Number of I/O32--308
Oscillator TypeInternalExternal, InternalExternal, Internal--
Action

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