NXP Semiconductors MC9S08RE16CFDE Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 16KB FLASH 48QFN
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC9S08RE16CFDE
Detailed Description
IC MCU 8BIT 16KB FLASH 48QFN
Package
48-VFQFN Exposed Pad
Key Features
Package / Case: 48-VFQFN Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
MC9S08RE16CFDE Datasheet
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Technical Specifications
NXP Semiconductors MC9S08RE16CFDE Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
1K x 8
Package / Case
48-VFQFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
1.8V ~ 3.6V
Peripherals
LVD, POR, PWM, WDT
Number of I/O
39
Speed
8MHz
Core Processor
S08
Program Memory Type
Flash
Alternate Parts Comparison (MC9S08RE16CFDE vs MC9S08GT16CFDER vs MC9S08GT60CFDER vs MC9S08GT16ACFDE)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 48-VFQFN Exposed Pad | 48-VFQFN Exposed Pad | 48-VFQFN Exposed Pad | 48-VFQFN Exposed Pad |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 1.8V ~ 3.6V | 1.8V ~ 3.6V | 1.8V ~ 3.6V | 1.8V ~ 3.6V |
| Core Processor | S08 | S08 | S08 | S08 |
| Core Size | 8-Bit | 8-Bit | 8-Bit | 8-Bit |
| RAM Size | 1K x 8 | 1K x 8 | 4K x 8 | 2K x 8 |
| Connectivity | SCI | I²C, SCI, SPI | I²C, SCI, SPI | I²C, SCI, SPI |
| Number of I/O | 39 | 39 | 39 | 39 |
| Oscillator Type | Internal | Internal | Internal | Internal |
| Peripherals | LVD, POR, PWM, WDT | LVD, POR, PWM, WDT | LVD, POR, PWM, WDT | LVD, POR, PWM, WDT |
| Program Memory Size | 16KB (16K x 8) | 16KB (16K x 8) | 60KB (60K x 8) | 16KB (16K x 8) |
| Action |
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