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NXP Semiconductors MC9S08GT16ACFDE Microcontroller, Microprocessor, FPGA Modules

IC MCU 8BIT 16KB FLASH 48QFN

24,148 ActiveNXP Semiconductors48-VFQFN Exposed PadRoHS
MC9S08GT16ACFDE - No Image Available

Same model may have multiple batches, images only for reference.

MC9S08GT16ACFDE
Manufacturer
Part Number (MPN)
MC9S08GT16ACFDE
Detailed Description
IC MCU 8BIT 16KB FLASH 48QFN
Package
48-VFQFN Exposed Pad
Key Features
Package / Case: 48-VFQFN Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF MC9S08GT16ACFDE Datasheet
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Technical Specifications

NXP Semiconductors MC9S08GT16ACFDE Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
2K x 8
Package / Case
48-VFQFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
1.8V ~ 3.6V
Peripherals
LVD, POR, PWM, WDT
Number of I/O
39
Speed
40MHz
Core Processor
S08
Program Memory Type
Flash

Alternate Parts Comparison (MC9S08GT16ACFDE vs MC9S08RE16CFDE vs MC9S08GT16CFDER vs MC9S08GT60CFDER)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case48-VFQFN Exposed Pad48-VFQFN Exposed Pad48-VFQFN Exposed Pad48-VFQFN Exposed Pad
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)
Supply Voltage1.8V ~ 3.6V1.8V ~ 3.6V1.8V ~ 3.6V1.8V ~ 3.6V
Core ProcessorS08S08S08S08
Core Size8-Bit8-Bit8-Bit8-Bit
RAM Size2K x 81K x 81K x 84K x 8
ConnectivityI²C, SCI, SPISCII²C, SCI, SPII²C, SCI, SPI
Number of I/O39393939
Oscillator TypeInternalInternalInternalInternal
PeripheralsLVD, POR, PWM, WDTLVD, POR, PWM, WDTLVD, POR, PWM, WDTLVD, POR, PWM, WDT
Program Memory Size16KB (16K x 8)16KB (16K x 8)16KB (16K x 8)60KB (60K x 8)
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