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NXP Semiconductors LPC55S06JHI48QL Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 256KB FLASH 48HVQFN

1,574 ActiveNXP Semiconductors48-VFQFN Exposed PadRoHS
LPC55S06JHI48QL 48-VFQFN Exposed Pad package illustration

Same model may have multiple batches, images only for reference.

LPC55S06JHI48QL
Manufacturer
Part Number (MPN)
LPC55S06JHI48QL
Detailed Description
IC MCU 32BIT 256KB FLASH 48HVQFN
Package
48-VFQFN Exposed Pad
Key Features
Package / Case: 48-VFQFN Exposed Pad; Mounting Type: Surface Mount, Wettable Flank
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF LPC55S06JHI48QL Datasheet
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Technical Specifications

NXP Semiconductors LPC55S06JHI48QL Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
96K x 8
RoHS
Yes
Package / Case
48-VFQFN Exposed Pad
Mounting Type
Surface Mount, Wettable Flank
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
1.8V ~ 3.6V
Lifecycle Status
Active
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Number of I/O
30
Speed
96MHz

Alternate Parts Comparison (LPC55S06JHI48QL vs LPC5502JHI48J vs LPC5504JHI48J vs MM912J637AM2EPR2)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case48-VFQFN Exposed Pad48-VFQFN Exposed Pad48-VFQFN Exposed Pad48-VFQFN Exposed Pad
Mounting TypeSurface Mount, Wettable FlankSurface Mount, Wettable FlankSurface Mount, Wettable FlankSurface Mount
Operating Temperature-40°C ~ 105°C (TA)-40°C ~ 105°C (TA)-40°C ~ 105°C (TA)-40°C ~ 125°C
Supply Voltage1.8V ~ 3.6V1.8V ~ 3.6V1.8V ~ 3.6V2.25V ~ 5.5V
Core ProcessorARM® Cortex®-M33ARM® Cortex®-M33ARM® Cortex®-M33S12
RAM Size96K x 848K x 880K x 86K x 8
RoHSYesYesYesYes
Lifecycle StatusActiveActiveActiveActive
Number of I/O3030308
PackageSOT619-28SOT619-28HVQFN-48QFN-48
Program Memory TypeFlashFlashFlashFLASH (128kB)
Core Size32-Bit Single-Core32-Bit32-Bit--
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