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STMicroelectronics STGB30V60DF BJTs

Trans IGBT Chip N-CH 600V 60A 3-Pin(2+Tab) D2PAK T/R

28 ActiveSTMicroelectronicsTO-263-3, D2PAK (2 Leads + Tab), TO-263AB$6.97
STGB30V60DF - No Image Available

Same model may have multiple batches, images only for reference.

STGB30V60DF
Manufacturer
Part Number (MPN)
STGB30V60DF
Detailed Description
Trans IGBT Chip N-CH 600V 60A 3-Pin(2+Tab) D2PAK T/R
Package
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Lifecycle Status
Active
Datasheet
PDF STGB30V60DF Datasheet
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Technical Specifications

STMicroelectronics STGB30V60DF BJTs technical specifications.

General

Package / Case
TO-263-3, D2PAK
Mounting Type
Surface Mount
Operating Temperature
-55°C ~ 175°C (TJ)
Lifecycle Status
Active
Input Type
Standard
Gate Charge
163 nC
Td on Off 25 C
45ns/189ns
Test Condition
400V, 30A, 10Ohm, 15V
Igbt Type
Trench Field Stop
Reverse Recovery Time Trr
53 ns

Alternate Parts Comparison (STGB30V60DF vs STGB20NB41LZT4 vs STGB10NB37LZT4 vs STGB14NC60KDT4)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / CaseTO-263-3, D2PAKTO-263-3, D2PAKTO-263-3, D2PAKTO-263-3, D2PAK
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-55°C ~ 175°C (TJ)-55°C ~ 175°C (TJ)-65°C ~ 175°C (TJ)-55°C ~ 150°C (TJ)
Lifecycle StatusActiveActiveActiveActive
Current Collector IC Max60 A40 A20 A25 A
Current Collector Pulsed Icm120 A80 A40 A50 A
Description--------
Detailed Description--------
Gate Charge163 nC46 nC28 nC34.4 nC
Input TypeStandardStandardStandardStandard
Power Max258 W200 W125 W80 W
Switching Energy383µJ (on), 233µJ (off)5mJ (on), 12.9mJ (off)2.4mJ (on), 5mJ (off)82µJ (on), 155µJ (off)
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