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Samsung Semiconductor K4B2G1646Q-BCK0 DRAM

DDR DRAM, 128MX16, 0.225ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96

4,000 ActiveSamsung Semiconductor$11.84RoHS
K4B2G1646Q-BCK0 - No Image Available

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K4B2G1646Q-BCK0
Part Number (MPN)
K4B2G1646Q-BCK0
Detailed Description
DDR DRAM, 128MX16, 0.225ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF K4B2G1646Q-BCK0 Datasheet
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Technical Specifications

Samsung Semiconductor K4B2G1646Q-BCK0 DRAM technical specifications.

General

RoHS
Yes
Number of Pins
96
Operating Temperature
0 ~ 85
Terminal Position
BOTTOM
Jedec Package Code
R-PBGA-B96
Width
7.5
Length
13.3
Number of Functions
1
Temperature Grade
OTHER
Supply Voltage Nom Vsup
1.5

Alternate Parts Comparison (K4B2G1646Q-BCK0 vs K4B2G1646Q-BCMA vs K4B2G0846D-HCH9 vs K4M561633G-BN75)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Operating Temperature0 ~ 85--0 ~ 95-25 ~ 85
Number of Pins96--7854
RoHSYes--CompliantYes
Access Time Max0.225----5.4
Clock Frequency Max Fclk800----133
IO TypeCOMMON----COMMON
Jedec Package CodeR-PBGA-B96----R-PBGA-B54
Lead FreeYes----Yes
Length13.3----11
Memory IC TypeDDR DRAM----SYNCHRONOUS DRAM
Military SpecFalse----False
Number of Functions1----1
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