Renesas DS70830AN80BGV Microcontroller, Microprocessor, FPGA Modules
IC DS70830AN80BGV
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
DS70830AN80BGV
Detailed Description
IC DS70830AN80BGV
Package
112-LFBGA
Key Features
Package / Case: 112-LFBGA; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
DS70830AN80BGV Datasheet
Quick Jump:
Technical Specifications
Renesas DS70830AN80BGV Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Series
SuperH® SH7080
RAM Size
16K x 8
RoHS
True
Package / Case
112-LFBGA
Mounting Type
Surface Mount
Operating Temperature
-20°C ~ 85°C (TA)
Supply Voltage
3V ~ 5.5V
Lifecycle Status
Obsolete
Peripherals
DMA, POR, PWM, WDT
Number of I/O
65
Alternate Parts Comparison (DS70830AN80BGV vs R7S910022CBG#AC0 vs R7S910023CBG#AC0 vs DF2218CUBR24V)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 112-LFBGA | 112-LFBGA | 112-LFBGA | 112-LFBGA |
| Operating Temperature | -20°C ~ 85°C (TA) | -40°C ~ 110°C (TJ) | -40°C ~ 110°C (TJ) | -20°C ~ 75°C (TA) |
| Supply Voltage | 3V ~ 5.5V | 1.14V ~ 3.6V | 1.14V ~ 3.6V | 2.7V ~ 3.6V |
| Core Processor | SH-2 | ARM® Cortex®-R4F | ARM® Cortex®-R4F | H8S/2000 |
| Core Size | 32-Bit Single-Core | 32-Bit | 32-Bit | 16-Bit |
| Connectivity | EBI/EMI, FIFO, I²C, SCI, SSU, UART/USART | CSI, I²C, SPI, UART/USART | CSI, I²C, SPI, UART/USART | SCI, SmartCard, USB |
| Data Converters | A/D 8x10b SAR | A/D 16x12b | A/D 16x12b | A/D 6x10b |
| Oscillator Type | Internal | Internal | Internal | External |
| Peripherals | DMA, POR, PWM, WDT | DMA, POR, PWM, WDT | DMA, POR, PWM, WDT | DMA, POR, PWM, WDT |
| Program Memory Type | ROMless | ROMless | ROMless | Flash |
| Speed | 80MHz | 450MHz | 450MHz | 24MHz |
| RAM Size | 16K x 8 | -- | 1.568M x 8 | 12K x 8 |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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