NXP Semiconductors MPC5517GAVMG80 Microcontroller, Microprocessor, FPGA Modules
IC MCU 32B 1.5MB FLASH 208MAPBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MPC5517GAVMG80
Detailed Description
IC MCU 32B 1.5MB FLASH 208MAPBGA
Package
208-BGA
Key Features
Package / Case: 208-BGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
MPC5517GAVMG80 Datasheet
Quick Jump:
Technical Specifications
NXP Semiconductors MPC5517GAVMG80 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
80K x 8
Package / Case
208-BGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
1.35V ~ 1.65V
Lifecycle Status
Active
Peripherals
DMA, POR, PWM, WDT
Number of I/O
144
Speed
80MHz
Core Processor
e200z1
Alternate Parts Comparison (MPC5517GAVMG80 vs S912XEP100J5CVL vs MAC7131MVF40R2 vs MC9S12XEP100CVL)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 208-BGA | 208-BGA | 208-BGA | 208-BGA |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 105°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 1.35V ~ 1.65V | 1.72V ~ 5.5V | 2.35V ~ 5.5V | 1.72V ~ 5.5V |
| Core Processor | e200z1 | HCS12X | ARM7® | HCS12X |
| Core Size | 32-Bit Single-Core | 16-Bit | 32-Bit Single-Core | 16-Bit |
| RAM Size | 80K x 8 | 64K x 8 | 32K x 8 | 64K x 8 |
| Connectivity | CANbus, EBI/EMI, I²C, SCI, SPI | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | CANbus, EBI/EMI, I²C, SCI, SPI | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI |
| Data Converters | A/D 40x12b | A/D 32x12b | A/D 32x8/10b | A/D 32x12b |
| Number of I/O | 144 | 152 | 128 | 152 |
| Oscillator Type | External | External | Internal | External |
| Peripherals | DMA, POR, PWM, WDT | LVD, POR, PWM, WDT | DMA, POR | LVD, POR, PWM, WDT |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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