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Renesas DF70834AD80BGV Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 256KB FLSH 112LFBGA

1,745 ActiveRenesas112-LFBGARoHS
DF70834AD80BGV 112-LFBGA package illustration

Same model may have multiple batches, images only for reference.

DF70834AD80BGV
Manufacturer
Part Number (MPN)
DF70834AD80BGV
Detailed Description
IC MCU 32BIT 256KB FLSH 112LFBGA
Package
112-LFBGA
Key Features
Package / Case: 112-LFBGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF DF70834AD80BGV Datasheet
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Technical Specifications

Renesas DF70834AD80BGV Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Interface
EBI/EMI, I2C, SCI
Memory Size
256 kB
RAM Size
16K x 8
Data Bus Width
32 b
RoHS
Yes
Number of Pins
112
Package / Case
112-LFBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
3V ~ 5.5V

Related Parts Comparison (DF70834AD80BGV vs DF2218CUBR24V vs DF2218UBR24V vs DF2238RBR13WV)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Package / Case112-LFBGA112-LFBGA112-LFBGA112-LFBGA
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 85°C (TA)-20°C ~ 75°C (TA)-20°C ~ 75°C (TA)-40°C ~ 85°C (TA)
Supply Voltage3V ~ 5.5V2.7V ~ 3.6V2.7V ~ 3.6V2.2V ~ 3.6V
Core ProcessorSH-2H8S/2000H8S/2000H8S/2000
Core Size32-Bit Single-Core16-Bit16-Bit16-Bit
RAM Size16K x 812K x 812K x 816K x 8
RoHSYesYesYesYes
Lifecycle StatusActiveObsoleteObsoleteActive
ConnectivityEBI/EMI, FIFO, I²C, SCI, SSUSCI, SmartCard, USBSCI, SmartCard, USBI²C, SCI, SmartCard
Data ConvertersA/D 8x10bA/D 6x10bA/D 6x10bA/D 8x10b; D/A 2x8b
Number of I/O65696972
Action

Cross Reference

Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .

Suggested replacements

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