Renesas DF70835AN80BGV Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT 512KB FLSH 112LFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
DF70835AN80BGV
Detailed Description
IC MCU 32BIT 512KB FLSH 112LFBGA
Package
112-LFBGA
Key Features
Package / Case: 112-LFBGA; Mounting Type: Surface Mount
Lifecycle Status
Not For New Designs
RoHS State
RoHS Compliant
Datasheet
DF70835AN80BGV Datasheet
Quick Jump:
Technical Specifications
Renesas DF70835AN80BGV Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
32K x 8
RoHS
True
Package / Case
112-LFBGA
Mounting Type
Surface Mount
Operating Temperature
-20°C ~ 85°C (TA)
Supply Voltage
3V ~ 5.5V
Lifecycle Status
Not For New Designs
Peripherals
DMA, POR, PWM, WDT
Number of I/O
65
Speed
80MHz
Alternate Parts Comparison (DF70835AN80BGV vs DF2218CUBR24V vs DF2218UBR24V vs DF2238RBR13WV)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 112-LFBGA | 112-LFBGA | 112-LFBGA | 112-LFBGA |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -20°C ~ 85°C (TA) | -20°C ~ 75°C (TA) | -20°C ~ 75°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 3V ~ 5.5V | 2.7V ~ 3.6V | 2.7V ~ 3.6V | 2.2V ~ 3.6V |
| Core Processor | SH-2 | H8S/2000 | H8S/2000 | H8S/2000 |
| Core Size | 32-Bit Single-Core | 16-Bit | 16-Bit | 16-Bit |
| RAM Size | 32K x 8 | 12K x 8 | 12K x 8 | 16K x 8 |
| Connectivity | EBI/EMI, FIFO, I²C, SCI, SSU | SCI, SmartCard, USB | SCI, SmartCard, USB | I²C, SCI, SmartCard |
| Data Converters | A/D 8x10b | A/D 6x10b | A/D 6x10b | A/D 8x10b; D/A 2x8b |
| Number of I/O | 65 | 69 | 69 | 72 |
| Oscillator Type | Internal | External | External | Internal |
| Peripherals | DMA, POR, PWM, WDT | DMA, POR, PWM, WDT | DMA, POR, PWM, WDT | POR, PWM, WDT |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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