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NXP Semiconductors MPC564MZP66 Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 512KB FLASH 388PBGA

2,654NXP Semiconductors388-BBGARoHS
MPC564MZP66 388-BBGA package illustration

Same model may have multiple batches, images only for reference.

MPC564MZP66
Manufacturer
Part Number (MPN)
MPC564MZP66
Detailed Description
IC MCU 32BIT 512KB FLASH 388PBGA
Package
388-BBGA
Key Features
Package / Case: 388-BBGA; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF MPC564MZP66 Datasheet
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Technical Specifications

NXP Semiconductors MPC564MZP66 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Series
MPC56x
RAM Size
32K x 8
Data Bus Width
32 bit
Maximum Clock Frequency
66 MHz
RoHS
Yes
Package / Case
388-BBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
2.5V ~ 2.7V
Lifecycle Status
Obsolete

Alternate Parts Comparison (MPC564MZP66 vs MPC561MZP56R2 vs MPC562MZP66R2 vs MPC563MZP56R2)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case388-BBGA388-BBGA388-BBGA388-BBGA
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)
Supply Voltage2.5V ~ 2.7V2.5V ~ 2.7V2.5V ~ 2.7V2.5V ~ 2.7V
Core ProcessorPowerPCPowerPCPowerPCPowerPC
Core Size32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core
RAM Size32K x 832K x 832K x 832K x 8
RoHSYesYesYesYes
Lifecycle StatusObsoleteNot For New DesignsObsoleteNot For New Designs
ConnectivityCANbus, EBI/EMI, SCI, SPI, UART/USARTCANbus, EBI/EMI, SCI, SPI, UART/USARTCANbus, EBI/EMI, SCI, SPI, UART/USARTCANbus, EBI/EMI, SCI, SPI, UART/USART
Data ConvertersA/D 32x10bA/D 32x10bA/D 32x10bA/D 32x10b
Number of I/O56646456
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