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NXP Semiconductors MPC562MZP66R2 Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT ROMLESS 388PBGA

9,232NXP Semiconductors388-BBGARoHS
MPC562MZP66R2 - No Image Available

Same model may have multiple batches, images only for reference.

MPC562MZP66R2
Manufacturer
Part Number (MPN)
MPC562MZP66R2
Detailed Description
IC MCU 32BIT ROMLESS 388PBGA
Package
388-BBGA
Key Features
Package / Case: 388-BBGA; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF MPC562MZP66R2 Datasheet
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Technical Specifications

NXP Semiconductors MPC562MZP66R2 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Series
MPC5xx
RAM Size
32K x 8
RoHS
True
Package / Case
388-BBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
2.5V ~ 2.7V
Lifecycle Status
Obsolete
Peripherals
POR, PWM, WDT
Number of I/O
64

Alternate Parts Comparison (MPC562MZP66R2 vs MPC563MZP56R2 vs MPC565MZP56 vs MPC565CZP40R2)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case388-BBGA388-BBGA388-BBGA388-BBGA
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)-40°C ~ 85°C (TA)
Supply Voltage2.5V ~ 2.7V2.5V ~ 2.7V2.5V ~ 2.7V2.5V ~ 2.7V
Core ProcessorPowerPCPowerPCPowerPCPowerPC
Core Size32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core
RAM Size32K x 832K x 836K x 836K x 8
ConnectivityCANbus, EBI/EMI, SCI, SPI, UART/USARTCANbus, EBI/EMI, SCI, SPI, UART/USARTCANbus, EBI/EMI, SCI, SPI, UART/USARTCANbus, EBI/EMI, SCI, SPI, UART/USART
Data ConvertersA/D 32x10bA/D 32x10bA/D 40x10bA/D 40x10b
Number of I/O64565656
Oscillator TypeExternalExternalExternalExternal
PeripheralsPOR, PWM, WDTPOR, PWM, WDTPOR, PWM, WDTPOR, PWM, WDT
Action

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