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NXP Semiconductors MPCZ563MZP66R Microcontroller, Microprocessor, FPGA Modules

MPCZ563MZP66 - GREEN OAK-512K FL

5,634 ActiveNXP Semiconductors388-BBGARoHS
MPCZ563MZP66R - No Image Available

Same model may have multiple batches, images only for reference.

MPCZ563MZP66R
Manufacturer
Part Number (MPN)
MPCZ563MZP66R
Detailed Description
MPCZ563MZP66 - GREEN OAK-512K FL
Package
388-BBGA
Key Features
Package / Case: 388-BBGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF MPCZ563MZP66R Datasheet
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Technical Specifications

NXP Semiconductors MPCZ563MZP66R Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Series
MPC56xx
RAM Size
32K x 8
RoHS
True
Package / Case
388-BBGA
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
2.5V ~ 2.7V
Lifecycle Status
Active
Peripherals
POR, PWM, WDT
Speed
66MHz
Connectivity
CANbus, EBI/EMI, SCI, SPI, UART/USART

Alternate Parts Comparison (MPCZ563MZP66R vs MCF5471VR200 vs MCF5473VR200 vs MCF5481CZP166)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case388-BBGA388-BBGA388-BBGA388-BBGA
Operating Temperature-40°C ~ 125°C (TA)0°C ~ 70°C (TA)0°C ~ 70°C (TA)-40°C ~ 85°C (TA)
Supply Voltage2.5V ~ 2.7V1.43V ~ 1.58V1.43V ~ 1.58V1.43V ~ 1.58V
Core ProcessorPowerPCColdfire V4EColdfire V4EColdfire V4E
Core Size32-Bit32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core
RAM Size32K x 832K x 832K x 832K x 8
ConnectivityCANbus, EBI/EMI, SCI, SPI, UART/USARTEBI/EMI, Ethernet, I²C, SPI, UART/USART, USBEBI/EMI, Ethernet, I²C, SPI, UART/USART, USBCANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
Oscillator TypeExternalExternalExternalExternal
PeripheralsPOR, PWM, WDTDMA, PWM, WDTDMA, PWM, WDTDMA, PWM, WDT
Program Memory TypeFlashROMlessROMlessROMless
Speed66MHz200MHz200MHz166MHz
Mounting Type--Surface MountSurface MountSurface Mount
Action

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