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NXP Semiconductors MPC563CZP66 Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 512KB FLASH 388PBGA

5,547NXP Semiconductors388-BBGARoHS
MPC563CZP66 388-BBGA package illustration

Same model may have multiple batches, images only for reference.

MPC563CZP66
Manufacturer
Part Number (MPN)
MPC563CZP66
Detailed Description
IC MCU 32BIT 512KB FLASH 388PBGA
Package
388-BBGA
Key Features
Package / Case: 388-BBGA; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF MPC563CZP66 Datasheet
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Technical Specifications

NXP Semiconductors MPC563CZP66 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Series
MPC5xx
RAM Size
32K x 8
RoHS
Yes
Package / Case
388-BBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.5V ~ 2.7V
Lifecycle Status
Obsolete
Peripherals
POR, PWM, WDT
Number of I/O
56

Related Parts Comparison (MPC563CZP66 vs MPC561MZP56R2 vs MPC562MZP66R2 vs MPC563MZP56R2)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Package / Case388-BBGA388-BBGA388-BBGA388-BBGA
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 85°C (TA)-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)
Supply Voltage2.5V ~ 2.7V2.5V ~ 2.7V2.5V ~ 2.7V2.5V ~ 2.7V
Core ProcessorPowerPCPowerPCPowerPCPowerPC
Core Size32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core
RAM Size32K x 832K x 832K x 832K x 8
RoHSYesYesYesYes
Lifecycle StatusObsoleteNot For New DesignsObsoleteNot For New Designs
ConnectivityCANbus, EBI/EMI, SCI, SPI, UART/USARTCANbus, EBI/EMI, SCI, SPI, UART/USARTCANbus, EBI/EMI, SCI, SPI, UART/USARTCANbus, EBI/EMI, SCI, SPI, UART/USART
Data ConvertersA/D 32x10bA/D 32x10bA/D 32x10bA/D 32x10b
Number of I/O56646456
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