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Winbond Electronics W987D2HBJX6E DRAM

DRAM Memory IC 128Mbit Parallel 166 MHz 1.7V ~ 1.95V 90-VFBGA (8x13)

2,374Winbond Electronics90-VFBGA (8x13)$40.85
W987D2HBJX6E 90-VFBGA (8x13) package illustration

Same model may have multiple batches, images only for reference.

W987D2HBJX6E
Part Number (MPN)
W987D2HBJX6E
Detailed Description
IC DRAM 128MBIT PAR 90VFBGA
Package
90-VFBGA (8x13)
Lifecycle Status
Last Time Buy
Datasheet
PDF W987D2HBJX6E Datasheet
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Technical Specifications

Winbond Electronics W987D2HBJX6E DRAM technical specifications.

General

Memory Size
128 Mbit
Package / Case
90-TFBGA
Packaging
Tray
Mounting Type
Surface Mount
Operating Temperature
-25°C ~ 85°C (TC)
Supply Voltage
1.7V ~ 1.95V
Lifecycle Status
Last Time Buy
MSL Level
3 (168 Hours)
Max Frequency
166 MHz
Memory Interface
Parallel

Related Parts Comparison (W987D2HBJX6E vs W9825G6KH-6 vs W949D2DBJX5I vs W988D2FBJX6I)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-25°C ~ 85°C (TC)0 ~ 70-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)
Supply Voltage1.7V ~ 1.95V3 ~ 3.61.7V ~ 1.95V1.7V ~ 1.95V
Memory Size128 Mbit256M512 Mbit256 Mbit
Lifecycle StatusLast Time BuyActiveActiveLast Time Buy
Access Time5.4 ns6 ns5 ns5.4 ns
Memory Organization4M x 3216 M x 1616M x 328M x 32
Package / Case90-TFBGA--90-TFBGA90-TFBGA
Clock Frequency166 MHz--200 MHz166 MHz
Max Frequency166 MHz--200 MHz166 MHz
Memory FormatDRAM--DRAMDRAM
Memory InterfaceParallel--ParallelParallel
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