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Winbond Electronics W947D2HBJX6E DRAM

DRAM Memory IC 128Mbit Parallel 166 MHz 1.7V ~ 1.95V 90-VFBGA (8x13)

In Stock ActiveWinbond Electronics90-VFBGA (8x13)RoHS
W947D2HBJX6E 90-VFBGA (8x13) package illustration

Same model may have multiple batches, images only for reference.

W947D2HBJX6E
Part Number (MPN)
W947D2HBJX6E
Detailed Description
IC DRAM 128MBIT PAR 90VFBGA
Package
90-VFBGA (8x13)
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF W947D2HBJX6E Datasheet
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Technical Specifications

Winbond Electronics W947D2HBJX6E DRAM technical specifications.

General

Memory Size
128 Mbit
RoHS
ROHS3 Compliant
Package / Case
90-TFBGA
Packaging
Tray
Mounting Type
Surface Mount
Operating Temperature
-25°C ~ 85°C (TC)
Supply Voltage
1.7V ~ 1.95V
Lifecycle Status
Active
Max Frequency
166 MHz
Memory Type
Volatile

Alternate Parts Comparison (W947D2HBJX6E vs W9825G6KH-6 vs W987D2HBJX6E vs W949D2DBJX5I)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-25°C ~ 85°C (TC)0 ~ 70-25°C ~ 85°C (TC)-40°C ~ 85°C (TA)
Supply Voltage1.7V ~ 1.95V3 ~ 3.61.7V ~ 1.95V1.7V ~ 1.95V
Memory Size128 Mbit256M128 Mbit512 Mbit
Lifecycle StatusActiveActiveLast Time BuyActive
Access Time5 ns6 ns5.4 ns5 ns
Memory Organization4M x 3216 M x 164M x 3216M x 32
Package / Case90-TFBGA--90-TFBGA90-TFBGA
RoHSROHS3 CompliantCompliant--ROHS3 Compliant
Clock Frequency166 MHz--166 MHz200 MHz
Max Frequency166 MHz--166 MHz200 MHz
Memory FormatDRAM--DRAMDRAM
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