Winbond Electronics W66BQ2NQUAGJ DRAM
2GB LPDDR4X, DDP, X32, 1866MHZ,

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W66BQ2NQUAGJ
Detailed Description
Package
200-WFBGA (10x14.5)
Key Features
Package: Tray; Package / Case: 200-WFBGA; Mounting Type: Surface Mount; Supply Voltage: 1.06V ~ 1.17V, 1.7V ~ 1.95V; Memory Size: 2Gbit
Lifecycle Status
Active
RoHS State
Unknown
Datasheet
W66BQ2NQUAGJ Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W66BQ2NQUAGJ DRAM technical specifications.
General
Max Frequency
1.867 GHz
Operating Temperature
-40°C ~ 105°C (TC)
Memory Interface
LVSTL_06
Memory Organization
64M x 32
Mounting Type
Surface Mount
Memory Type
Volatile
Lifecycle Status
Active
Supplier Device Package
200-WFBGA (10x14.5)
Access Time
3.6 ns
Write Cycle Time Word Page
18ns
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
W66CL2NQUAFJWinbond ElectronicsPackage: Tray | Package / Case: 200-WFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.06V ~ 1.17V, 1.7V ~ 1.95V | Memory Size: 4Gbit | Interface: LVSTL_11 | Operating Temperature: -40°C ~ 105°C (TC) | Number of Pins: 200
W66BL6NBUAHJWinbond ElectronicsPackage: Tray | Package / Case: 200-WFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.06V ~ 1.17V, 1.7V ~ 1.95V | Memory Size: 2Gbit | Operating Temperature: -40°C ~ 105°C (TC)
W66AP6NBUAFJWinbond ElectronicsPackage: Tray | Package / Case: 200-WFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.06V ~ 1.17V, 1.7V ~ 1.95V | Memory Size: 1Gbit | Operating Temperature: -40°C ~ 105°C (TC) | Organization: 64 M x 16
W66BQ6NBUAHJWinbond ElectronicsPackage: Tray | Package / Case: 200-WFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.06V ~ 1.17V, 1.7V ~ 1.95V | Memory Size: 2Gbit | Operating Temperature: -40°C ~ 105°C (TC) | Organization: 128 M x 16