Winbond Electronics W66BM6NBUAGJ DRAM
IC DRAM 2GBIT LVSTL 11 200WFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W66BM6NBUAGJ
Detailed Description
Package
200-WFBGA (10x14.5)
Key Features
Package: Tray; Package / Case: 200-WFBGA; Mounting Type: Surface Mount; Supply Voltage: 1.06V ~ 1.17V, 1.7V ~ 1.95V; Memory Size: 2Gbit
Lifecycle Status
Not For New Designs
RoHS State
Compliant
Datasheet
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Technical Specifications
Winbond Electronics W66BM6NBUAGJ DRAM technical specifications.
General
Max Frequency
1.866 GHz
Memory Type
Volatile
Lifecycle Status
Not For New Designs
Supplier Device Package
200-WFBGA (10x14.5)
Access Time
3.5 ns
Package / Case
200-WFBGA
Technology
SDRAM - Mobile LPDDR4X
Supply Voltage
1.06V ~ 1.17V, 1.7V ~ 1.95V
Reach Status
REACH Unaffected
Mfr
Winbond Electronics
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