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Samsung Semiconductor K4H561638F-TCA2 DRAM

DRAM Memory IC 256Mb 266MHz TSOP

In Stock ActiveSamsung SemiconductorTSOPRoHS
K4H561638F-TCA2 TSOP package illustration

Same model may have multiple batches, images only for reference.

K4H561638F-TCA2
Part Number (MPN)
K4H561638F-TCA2
Detailed Description
DRAM Chip DDR SDRAM 256M-Bit 16Mx16 2.5V 66-Pin TSOP-II
Package
TSOP
Key Features
Package / Case: TSOP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
No
Datasheet
PDF K4H561638F-TCA2 Datasheet
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Technical Specifications

Samsung Semiconductor K4H561638F-TCA2 DRAM technical specifications.

General

RoHS
No
Package / Case
TSOP
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 70°C
Access Time Max
0.75ns
Address Bus Width
15b
Density
256Mb
Max Frequency
266MHz

Alternate Parts Comparison (K4H561638F-TCA2 vs K4S281632K-UC75 vs K4S641632K-UI60 vs K4S281632I-UC75)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / CaseTSOPTSOPTSOPTSOP
RoHSNoYesCompliantYes
Frequency--133MHz166MHz133MHz
Access Time--7.5ns6ns7.5ns
Lead Free--Lead FreeLead FreeLead Free
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