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NXP Semiconductors MM912JP812AMAF Microcontroller, Microprocessor, FPGA Modules

IC DRVR INJECTOR/IGN 100LQFP

1,691NXP Semiconductors100-LQFP Exposed PadRoHS
MM912JP812AMAF 100-LQFP Exposed Pad package illustration

Same model may have multiple batches, images only for reference.

MM912JP812AMAF
Manufacturer
Part Number (MPN)
MM912JP812AMAF
Detailed Description
IC DRVR INJECTOR/IGN 100LQFP
Package
100-LQFP Exposed Pad
Key Features
Package / Case: 100-LQFP Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF MM912JP812AMAF Datasheet
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Technical Specifications

NXP Semiconductors MM912JP812AMAF Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Interface
CAN, SCI, SPI
RAM Size
6K x 8
RoHS
Yes
Package / Case
100-LQFP Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C
Supply Voltage
4.7V ~ 36V
Lifecycle Status
Obsolete
Number of I/O
8
Core Processor
S12P

Alternate Parts Comparison (MM912JP812AMAF vs MM912KS812AMAFR2 vs MM912JP812AMAFR2 vs MM912JS812AMAF)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case100-LQFP Exposed Pad100-LQFP Exposed Pad100-LQFP Exposed Pad100-LQFP Exposed Pad
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 125°C-40°C ~ 125°C-40°C ~ 125°C-40°C ~ 125°C
Supply Voltage4.7V ~ 36V4.7V ~ 36V4.7V ~ 36V4.7V ~ 36V
InterfaceCAN, SCI, SPICAN, SCI, SPICAN, SCI, SPICAN, SCI, SPI
Core ProcessorS12PS12XSS12PS12XS
RAM Size6K x 812K x 86K x 88K x 8
RoHSYesYesYesYes
Lifecycle StatusObsoleteObsoleteObsoleteObsolete
ApplicationsEngine ControlEngine ControlEngine ControlEngine Control
Controller SeriesHCS12HCS12HCS12HCS12
Number of I/O8686
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