NXP Semiconductors MM912JS812AMAF Microcontroller, Microprocessor, FPGA Modules
IC DRVR INJECTOR/IGN 100LQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MM912JS812AMAF
Detailed Description
IC DRVR INJECTOR/IGN 100LQFP
Package
100-LQFP Exposed Pad
Key Features
Package / Case: 100-LQFP Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
MM912JS812AMAF Datasheet
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Technical Specifications
NXP Semiconductors MM912JS812AMAF Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Interface
CAN, SCI, SPI
RAM Size
8K x 8
Package / Case
100-LQFP Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C
Supply Voltage
4.7V ~ 36V
Number of I/O
6
Core Processor
S12XS
Program Memory Type
FLASH (128kB)
Controller Series
HCS12
Alternate Parts Comparison (MM912JS812AMAF vs MM912KS812AMAFR2 vs MM912JP812AMAFR2 vs MM912IP812AMAFR2)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 100-LQFP Exposed Pad | 100-LQFP Exposed Pad | 100-LQFP Exposed Pad | 100-LQFP Exposed Pad |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 125°C | -40°C ~ 125°C | -40°C ~ 125°C | -40°C ~ 125°C |
| Supply Voltage | 4.7V ~ 36V | 4.7V ~ 36V | 4.7V ~ 36V | 4.7V ~ 36V |
| Interface | CAN, SCI, SPI | CAN, SCI, SPI | CAN, SCI, SPI | CAN, SCI, SPI |
| Core Processor | S12XS | S12XS | S12P | S12P |
| RAM Size | 8K x 8 | 12K x 8 | 6K x 8 | 6K x 8 |
| Applications | Engine Control | Engine Control | Engine Control | Engine Control |
| Controller Series | HCS12 | HCS12 | HCS12 | HCS12 |
| Number of I/O | 6 | 6 | 8 | 8 |
| Program Memory Type | FLASH (128kB) | FLASH (256kB) | FLASH (128kB) | FLASH (96KB) |
| Action |
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