NXP Semiconductors MM912KS812AMAFR2 Microcontroller, Microprocessor, FPGA Modules
IC MCU 16BIT HCS12 100LQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MM912KS812AMAFR2
Detailed Description
IC MCU 16BIT HCS12 100LQFP
Package
100-LQFP Exposed Pad
Key Features
Package / Case: 100-LQFP Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
MM912KS812AMAFR2 Datasheet
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Technical Specifications
NXP Semiconductors MM912KS812AMAFR2 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Interface
CAN, SCI, SPI
RAM Size
12K x 8
Package / Case
100-LQFP Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C
Supply Voltage
4.7V ~ 36V
Number of I/O
6
Core Processor
S12XS
Program Memory Type
FLASH (256kB)
Controller Series
HCS12
Alternate Parts Comparison (MM912KS812AMAFR2 vs MM912JP812AMAFR2 vs MM912JS812AMAF vs MM912IP812AMAFR2)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 100-LQFP Exposed Pad | 100-LQFP Exposed Pad | 100-LQFP Exposed Pad | 100-LQFP Exposed Pad |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 125°C | -40°C ~ 125°C | -40°C ~ 125°C | -40°C ~ 125°C |
| Supply Voltage | 4.7V ~ 36V | 4.7V ~ 36V | 4.7V ~ 36V | 4.7V ~ 36V |
| Interface | CAN, SCI, SPI | CAN, SCI, SPI | CAN, SCI, SPI | CAN, SCI, SPI |
| Core Processor | S12XS | S12P | S12XS | S12P |
| RAM Size | 12K x 8 | 6K x 8 | 8K x 8 | 6K x 8 |
| Applications | Engine Control | Engine Control | Engine Control | Engine Control |
| Controller Series | HCS12 | HCS12 | HCS12 | HCS12 |
| Number of I/O | 6 | 8 | 6 | 8 |
| Program Memory Type | FLASH (256kB) | FLASH (128kB) | FLASH (128kB) | FLASH (96KB) |
| Action |
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