NXP Semiconductors MC56F8357VPYE Microcontroller, Microprocessor, FPGA Modules
IC MCU 16BIT 256KB FLASH 160LQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC56F8357VPYE
Detailed Description
IC MCU 16BIT 256KB FLASH 160LQFP
Package
160-LQFP
Key Features
Package / Case: 160-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
MC56F8357VPYE Datasheet
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Technical Specifications
NXP Semiconductors MC56F8357VPYE Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
10K x 16
Package / Case
160-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
2.25V ~ 3.6V
Peripherals
POR, PWM, Temp Sensor, WDT
Number of I/O
76
Speed
60MHz
Core Processor
56800E
Program Memory Type
Flash
Alternate Parts Comparison (MC56F8357VPYE vs MC705P6ACDWE vs MC711K4CFNE4 vs MC56F8347VPYE)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 160-LQFP | 28-SOIC | 84-LCC | 160-LQFP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 105°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 105°C (TA) |
| Supply Voltage | 2.25V ~ 3.6V | 5 V | 4.5V ~ 5.5V | 2.25V ~ 3.6V |
| Core Processor | 56800E | HC05 | HC11 | 56800E |
| Core Size | 16-Bit | 8-Bit | 8-Bit | 16-Bit |
| RAM Size | 10K x 16 | 176 B | 768 x 8 | 6K x 16 |
| Connectivity | CANbus, EBI/EMI, SCI, SPI | SIO | SCI, SPI | CANbus, EBI/EMI, SCI, SPI |
| Data Converters | A/D 16x12b | A/D 4x8b | A/D 8x8b | A/D 16x12b |
| Number of I/O | 76 | 21 | 62 | 76 |
| Oscillator Type | External | Internal | Internal | External |
| Peripherals | POR, PWM, Temp Sensor, WDT | POR, WDT | POR, PWM, WDT | POR, PWM, Temp Sensor, WDT |
| Action |
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