NXP Semiconductors MC56F8157VPYE Microcontroller, Microprocessor, FPGA Modules
IC MCU 16BIT 256KB FLASH 160LQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC56F8157VPYE
Detailed Description
IC MCU 16BIT 256KB FLASH 160LQFP
Package
160-LQFP
Key Features
Package / Case: 160-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
MC56F8157VPYE Datasheet
Quick Jump:
Technical Specifications
NXP Semiconductors MC56F8157VPYE Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
8K x 16
Package / Case
160-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
2.25V ~ 3.6V
Lifecycle Status
Active
Peripherals
POR, PWM, WDT
Number of I/O
76
Speed
40MHz
Core Processor
56800E
Alternate Parts Comparison (MC56F8157VPYE vs MC705P6ACDWE vs MC711K4CFNE4 vs MC56F8347VPYE)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 160-LQFP | 28-SOIC | 84-LCC | 160-LQFP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 105°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 105°C (TA) |
| Supply Voltage | 2.25V ~ 3.6V | 5 V | 4.5V ~ 5.5V | 2.25V ~ 3.6V |
| Core Processor | 56800E | HC05 | HC11 | 56800E |
| Core Size | 16-Bit | 8-Bit | 8-Bit | 16-Bit |
| RAM Size | 8K x 16 | 176 B | 768 x 8 | 6K x 16 |
| Connectivity | EBI/EMI, SCI, SPI | SIO | SCI, SPI | CANbus, EBI/EMI, SCI, SPI |
| Data Converters | A/D 16x12b | A/D 4x8b | A/D 8x8b | A/D 16x12b |
| Number of I/O | 76 | 21 | 62 | 76 |
| Oscillator Type | External | Internal | Internal | External |
| Peripherals | POR, PWM, WDT | POR, WDT | POR, PWM, WDT | POR, PWM, Temp Sensor, WDT |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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