NXP Semiconductors MC34910G5ACR2 Power Management - Specialized
IC SYSTEM BASIS CHIP LIN 32-LQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC34910G5ACR2
Detailed Description
IC SYSTEM BASIS CHIP LIN 32-LQFP
Package
32-LQFP
Key Features
Package / Case: 32-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
MC34910G5ACR2 Datasheet
Quick Jump:
Technical Specifications
NXP Semiconductors MC34910G5ACR2 Power Management - Specialized technical specifications.
General
RoHS
True
Package / Case
32-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C
Supply Voltage
5.5V ~ 27V
Lifecycle Status
Active
Current Supply
4.5mA
Applications
System Basis Chip
Package
32-LQFP (7x7)
Related Parts Comparison (MC34910G5ACR2 vs MC705P6ACDWE vs MC711K4CFNE4 vs MC33911BAC)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 32-LQFP | 28-SOIC | 84-LCC | 32-LQFP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 125°C |
| Supply Voltage | 5.5V ~ 27V | 5 V | 4.5V ~ 5.5V | 5.5V ~ 27V |
| Applications | System Basis Chip | -- | -- | System Basis Chip |
| Current Supply | 4.5mA | -- | -- | 4.5mA |
| Core Processor | -- | HC05 | HC11 | -- |
| Core Size | -- | 8-Bit | 8-Bit | -- |
| RAM Size | -- | 176 B | 768 x 8 | -- |
| Connectivity | -- | SIO | SCI, SPI | -- |
| Data Converters | -- | A/D 4x8b | A/D 8x8b | -- |
| Number of I/O | -- | 21 | 62 | -- |
| Action |
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