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NXP Semiconductors MC33PF8200CLESR2 Power Management - Specialized

PF8200

48,785 ActiveNXP Semiconductors56-VFQFN Exposed PadRoHS
MC33PF8200CLESR2 - No Image Available

Same model may have multiple batches, images only for reference.

MC33PF8200CLESR2
Manufacturer
Part Number (MPN)
MC33PF8200CLESR2
Detailed Description
PF8200
Package
56-VFQFN Exposed Pad
Key Features
Package / Case: 56-VFQFN Exposed Pad; Mounting Type: Surface Mount, Wettable Flank
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF MC33PF8200CLESR2 Datasheet
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Technical Specifications

NXP Semiconductors MC33PF8200CLESR2 Power Management - Specialized technical specifications.

General

Package / Case
56-VFQFN Exposed Pad
Mounting Type
Surface Mount, Wettable Flank
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
2.5V ~ 5.5V
Applications
High Performance i.MX 8, S32x Processor Based

Alternate Parts Comparison (MC33PF8200CLESR2 vs MC33FS8405G0ESR2 vs MC33PF8100EPESR2 vs MC33PF8100EPES)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case56-VFQFN Exposed Pad56-VFQFN Exposed Pad56-VFQFN Exposed Pad56-VFQFN Exposed Pad
Mounting TypeSurface Mount, Wettable FlankSurface Mount, Wettable FlankSurface Mount, Wettable FlankSurface Mount, Wettable Flank
Operating Temperature-40°C ~ 105°C (TA)-40°C ~ 125°C (TA)-40°C ~ 105°C (TA)-40°C ~ 105°C (TA)
Supply Voltage2.5V ~ 5.5V60V2.5V ~ 5.5V2.7V ~ 5.5V
ApplicationsHigh Performance i.MX 8, S32x Processor Based--High Performance i.MX 8, S32x Processor BasedHigh Performance i.MX 8, S32x Processor Based
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More Parts in Special Purpose Power Management ICs

Browse additional parts from the same category, grouped by series, package type, and manufacturer. These are catalog suggestions — not verified pin-compatible alternates.