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NXP Semiconductors MC33912BACR2 Power Management - Specialized

IC SYSTEM BASIS CHIP 32LQFP

2,178 ActiveNXP Semiconductors32-LQFPRoHS
MC33912BACR2 32-LQFP package illustration

Same model may have multiple batches, images only for reference.

MC33912BACR2
Manufacturer
Part Number (MPN)
MC33912BACR2
Detailed Description
IC SYSTEM BASIS CHIP 32LQFP
Package
32-LQFP
Key Features
Package / Case: 32-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF MC33912BACR2 Datasheet
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Technical Specifications

NXP Semiconductors MC33912BACR2 Power Management - Specialized technical specifications.

General

RoHS
Yes
Package / Case
32-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C
Supply Voltage
5.5V ~ 27V
Lifecycle Status
Active
Current Supply
4.5mA
Applications
System Basis Chip
Feature Packaging
Tape and Reel
Feature Pin Count
32

Alternate Parts Comparison (MC33912BACR2 vs MC705P6ACDWE vs MC711K4CFNE4 vs MC33911BAC)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case32-LQFP28-SOIC84-LCC32-LQFP
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 125°C-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 125°C
Supply Voltage5.5V ~ 27V5 V4.5V ~ 5.5V5.5V ~ 27V
Lifecycle StatusActiveNot For New DesignsObsoleteActive
RoHSYesCompliant--Yes
Package32-LQFPSOP--SOT358-3
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