NXP Semiconductors MC33PF8200DEESR2 Integrated Circuits (ICs)
POWER MANAGEMENT IC I.MX8 PRE-PR
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC33PF8200DEESR2
Base Model
Detailed Description
POWER MANAGEMENT IC I.MX8 PRE-PR
Package
56-VFQFN Exposed Pad
Key Features
Package: 56-VFQFN Exposed Pad; Supply Voltage: 2.5V ~ 5.5V
Lifecycle Status
Active
Datasheet
MC33PF8200DEESR2 Datasheet
Quick Jump:
Technical Specifications
NXP Semiconductors MC33PF8200DEESR2 Integrated Circuits (ICs) technical specifications.
General
Package / Case
56-VFQFN Exposed Pad
Mounting Type
Surface Mount, Wettable Flank
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
2.5V ~ 5.5V
Package
56-VFQFN Exposed Pad
Applications
High Performance i.MX 8, S32x Processor Based
Alternate Parts Comparison (MC33PF8200DEESR2 vs MC33PF8200CLESR2 vs MC33PF8100EPESR2 vs MC33PF8100EPES)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 56-VFQFN Exposed Pad | 56-VFQFN Exposed Pad | 56-VFQFN Exposed Pad | 56-VFQFN Exposed Pad |
| Mounting Type | Surface Mount, Wettable Flank | Surface Mount, Wettable Flank | Surface Mount, Wettable Flank | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) |
| Supply Voltage | 2.5V ~ 5.5V | 2.5V ~ 5.5V | 2.5V ~ 5.5V | 2.7V ~ 5.5V |
| Applications | High Performance i.MX 8, S32x Processor Based | High Performance i.MX 8, S32x Processor Based | High Performance i.MX 8, S32x Processor Based | High Performance i.MX 8, S32x Processor Based |
| Action |
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