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NXP Semiconductors MC33PF8200CXESR2 Power Management - Specialized

POWER MANAGEMENT IC I.MX8 PRE-PR

2,998 ActiveNXP Semiconductors56-VFQFN Exposed PadRoHS
MC33PF8200CXESR2 56-VFQFN Exposed Pad package illustration

Same model may have multiple batches, images only for reference.

MC33PF8200CXESR2
Manufacturer
Part Number (MPN)
MC33PF8200CXESR2
Detailed Description
POWER MANAGEMENT IC I.MX8 PRE-PR
Package
56-VFQFN Exposed Pad
Key Features
Package / Case: 56-VFQFN Exposed Pad; Mounting Type: Surface Mount, Wettable Flank
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF MC33PF8200CXESR2 Datasheet
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Technical Specifications

NXP Semiconductors MC33PF8200CXESR2 Power Management - Specialized technical specifications.

General

RoHS
Yes
Package / Case
56-VFQFN Exposed Pad
Mounting Type
Surface Mount, Wettable Flank
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
2.5V ~ 5.5V
Lifecycle Status
Active
Applications
High Performance i.MX 8, S32x Processor Based
Package
HVQFN-56

Alternate Parts Comparison (MC33PF8200CXESR2 vs MC33FS8405G0ESR2 vs MC33PF8200CLESR2 vs MC33PF8100EPESR2)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case56-VFQFN Exposed Pad56-VFQFN Exposed Pad56-VFQFN Exposed Pad56-VFQFN Exposed Pad
Mounting TypeSurface Mount, Wettable FlankSurface Mount, Wettable FlankSurface Mount, Wettable FlankSurface Mount, Wettable Flank
Operating Temperature-40°C ~ 105°C (TA)-40°C ~ 125°C (TA)-40°C ~ 105°C (TA)-40°C ~ 105°C (TA)
Supply Voltage2.5V ~ 5.5V60V2.5V ~ 5.5V2.5V ~ 5.5V
Lifecycle StatusActiveActiveActiveActive
RoHSYesYesYes--
ApplicationsHigh Performance i.MX 8, S32x Processor Based--High Performance i.MX 8, S32x Processor BasedHigh Performance i.MX 8, S32x Processor Based
PackageHVQFN-56HVQFN-5656-VFQFN Exposed Pad--
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