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NXP Semiconductors LPC1820FBD144K Microcontroller, Microprocessor, FPGA Modules

SOT-486-1 Microcontroller Units (MCUs/MPUs/SOCs)

24,600 ActiveNXP Semiconductors144-LQFPRoHS
LPC1820FBD144K 144-LQFP package illustration

Same model may have multiple batches, images only for reference.

LPC1820FBD144K
Manufacturer
Part Number (MPN)
LPC1820FBD144K
Detailed Description
SOT-486-1 Microcontroller Units (MCUs/MPUs/SOCs)
Package
144-LQFP
Key Features
Package / Case: 144-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF LPC1820FBD144K Datasheet
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Technical Specifications

NXP Semiconductors LPC1820FBD144K Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Series
LPC18xx
RAM Size
168K x 8
RoHS
Yes
Package / Case
144-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.2V ~ 3.6V
Lifecycle Status
Active
Peripherals
Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number of I/O
83

Alternate Parts Comparison (LPC1820FBD144K vs MC68EN302AG20BT vs SPC5643LF2MLQ8 vs S912XEP100J5VAGR)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case144-LQFP144-LQFP144-LQFP144-LQFP
Operating Temperature-40°C ~ 85°C (TA)0°C ~ 70°C (TA)-40°C ~ 125°C (TA)-40°C ~ 105°C (TA)
Core ProcessorARM® Cortex®-M3M68000e200z4HCS12X
Lifecycle StatusActiveObsoleteActiveActive
Speed180MHz20MHz80MHz50MHz
Mounting TypeSurface Mount--Surface MountSurface Mount
Supply Voltage2.2V ~ 3.6V--3V ~ 5.5V1.72V ~ 5.5V
Core Size32-Bit--32-Bit Dual-Core16-Bit
RAM Size168K x 8--128K x 864K x 8
RoHSYesYes--Yes
ConnectivityCANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART--CANbus, FlexRay, LINbus, SPI, UART/USARTCANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Data ConvertersA/D 8x10b SAR; D/A 1x10b--A/D 32x12bA/D 24x12b
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